Teledyne Microwave Solutions


Teledyne Labtech Microwave offers a comprehensive build-to-print microwave module and microwave components manufacturing service, which includes DFM support.  Our microwave MIC production facility is housed in a class 10,000 clean room and accommodates ceramic circuit manufacture, laser drilling, laser welding, automatic chip placement and wire bond assembly.  Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements. 

Manufacturing Capability

  • MIC Assembly
    • Automatic chip and wire assembly
    • Deep access wirebonding
    • Wedge-wedge wirebonding
    • Ball-wedge wirebonding
    • Gold tapes for DC and RF connections
    • Eutectic attach of ceramic circuits to carrier
    • Eutectic attach of high power devices
    • Soft substrate and alumina assembly
  • Laser lid welding
  • In-house RF machining and box build
  • In-house microwave PCB manufacture
  • In-house painting facilities
  • PCB and SMT assembly

adobe_pdf_icon.png  Teledyne Labtech Brochure

micassembly strip

 


MMIC Packaging

Multi-LCP packageDrop-inTeledyne Labtech has developed an innovative low cost custom packaging solution utilising Teledyne Labtech's established microwave printed circuit board techniques and the use of low cost organic materials for single chip & MCM (Multichip Module) applications.

One such multichip module developed by Teledyne Labtech is a cavity package that demonstrates excellent thermal characteristics particularly through to the ground plane and by raising the MMICs in a precisely machined cavity, the resultant optimisation of short bond wire lengths, ensures minimal loss of chip performance.

The Teledyne Labtech low cost package technique continues to offer significant flexibility and can be adapted to cater for a wide range of MMIC (Multichip Module) designs, cavity dimensions and flexible footprint options.  Teledyne Labtech can also offer a package design and assembly service.

  • Single chip & multi chip module (MCM) solutions
  • LCP packages
  • Competitive pricing for high and low volume quantities
  • Excellent thermal performance >7w
  • Excellent RF performance at Ka band
  • Low cost tooling and short lead times for new designs
  • Perfect for auto assembly process
  • Available as SMD, Flip Chip, BGA, drop in and flange configurations
  • Flexible footprint and cavity changes available
     

Teledyne Labtech – Microwave broadband multichip module packaging solutions

 


RF/Microwave Test Capability

Test 002bTeledyne Labtech has extensive microwave alignment and microwave testing facilities, which ensures we can provide a complete turnkey microwave assembly solution. 

  • s-parameters to 40GHz
    • Gain
    • Gain ripple
    • Input and output return loss
  • Noise Figure to 26GHz
  • Power measurements to 20GHz
  • Spectral measurements to 20GHz
    • Harmonics
    • Spurius
  • Measurement over temperature -55ºC to +100ºC

 


Quality & Environment

Teledyne Labtech has a goal to reliably produce specification compliant products for our customers by designing and building quality into all aspects of our business.

Teledyne Labtech is committed to complying with the requirements and continually improving the effectiveness of the quality management system which is ISO9001 accredited.

We aim to achieve our objectives by the use of a fully integrated quality management system of which the key elements are:

  • Continuous process monitoring with advanced quality planning to ensure quality is built into our products and that we are consistently able to meet customer time-to-market and time-to-volume requirements
  • Customer and supplier partnerships to ensure requirements are fully understood and efficiently satisfied to mutual benefit
  • The establishment and maintenance of an environment which encourages all employees to pursue continuous improvement in the quality and productivity of products and services
  • To ensure that the quality policy is reviewed annually and is communicated within the organisation. Quality objectives will also be reviewed and be part of the management review
  • The Operations Manager of Teledyne Labtech is responsible for the quality of its products and services
  • Every assistance will be provided to customers' supplier quality assurance representatives for the fulfillment of their task

 

 BSI-Cert BLK ORN  BSI-Cert_BLK_ORN.jpg
 ISO 9001  ISO 14001

 


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Teledyne Microwave Solutions  |  11361 Sunrise Park Drive, Rancho Cordova, CA 95742

Phone: (800) 832-6869  |  © 2017 Teledyne Microwave Solutions. All rights reserved.