Teledyne Microwave Solutions

 Post-Bonded Metalback PCB

PCB circuit v1 200From concept through production, Teledyne Labtech has the capability to support the complete design cycle.  Our vast experience is used to advise and recommend solutions for a diverse range of products and processes.

  • Aluminium, Copper and Brass backing   
  • Double-sided and multi-layer bonding
  • Both conductive and non-conductive bond films 
  • Complex machined structures
  • Thermal Management Solutions
    • Silicon Aluminium
    • Copper/Invar/Copper
    • Copper/Molybdenum/Copper

 

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Teledyne Microwave Solutions  |  11361 Sunrise Park Drive, Rancho Cordova, CA 95742

Phone: (800) 832-6869  |  © 2017 Teledyne Microwave Solutions. All rights reserved.