Teledyne Labtech Microwave offers a comprehensive build-to-print microwave module and microwave components manufacturing service, which includes DFM support.  Our microwave MIC production facility is housed in a class 10,000 clean room and accommodates ceramic circuit manufacture, laser drilling, laser welding, automatic chip placement and wire bond assembly.  Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements. 

Manufacturing Capability

• MIC Assembly
  • Automatic chip and wire assembly
  • Deep access wirebonding
  • Wedge-wedge wirebonding
  • Ball-wedge wirebonding
  • Gold tapes for DC and RF connections
  • Eutectic attach of ceramic circuits to carrier
  • Eutectic attach of high power devices
  • Soft substrate and alumina assembly
• Laser lid welding
• In-house RF machining and box build
• In-house microwave PCB manufacture
• In-house painting facilities
• PCB and SMT assembly
  
  
  • BROCHURES
  • WHITEPAPERS

  • BROCHURES
  • WHITEPAPERS

  BROCHURES

  • TMS Labtech Corporate Brochure
  • TMS Labtech PCB Capability Brochure
  • TMS Labtech MMIC Brochure
  • PCB Brochure

  WHITEPAPERS

  • High Frequency Single & Multi-chip Modules based on LCP Substrates
  • MMIC module for a Ku band miniature airborne Active Array Radar
  • Millimeter-wave SMT Low Cost Plastic Packages for Automotive RADAR at 77 GHz and High Data Rate E-band Radios
  • A 1-Watt Ku-band Power Amplifier MMIC using Cost-effective Organic SMD Package
  • Novel Cost-efficient Packaging Technology for High-Power LDMOS Devices
  • Novel Organic SMD Package for High-Power Millimeter Wave MMICs
  • Pin Switches and Switch Drivers – An Overview