Teledyne Labtech Microwave offers a comprehensive build-to-print microwave module and microwave components manufacturing service, which includes DFM support. Our microwave MIC production facility is housed in a class 10,000 clean room and accommodates ceramic circuit manufacture, laser drilling, laser welding, automatic chip placement and wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
Manufacturing Capability
- MIC Assembly
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Automatic chip and wire assembly
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Deep access wirebonding
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Wedge-wedge wirebonding
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Ball-wedge wirebonding
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Gold tapes for DC and RF connections
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Eutectic attach of ceramic circuits to carrier
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Eutectic attach of high power devices
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Soft substrate and alumina assembly
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Laser lid welding
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In-house RF machining and box build
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In-house microwave PCB manufacture
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In-house painting facilities
- PCB and SMT assembly