Teledyne Microwave Solutions

For many years Teledyne Labtech has prided itself on being at the forefront of RF/Microwave PCB development. Teledyne Labtech were also one of the first companies to successfully develop techniques for embedding SMD devices within multilayer structures and the embedding of connector pins in buried stripline circuits.

The advantages of such a structure ensure a much higher density of interconnect and removes the need for via hole connections to the board surface or the need to create access pockets to the inner layers. Consequently you finish with a board with lower RF/Microwave losses, this is particulalry important when designing large RF feed networks or 16:1 power dividers.

Embedded resistor 002  Embedded resistor 001  Embedded Connector 001 
Embedded SMT Device Connection to Buried Stripline Embedded connector pin in RF/Microwave Feed Network


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