From concept through production, Teledyne Labtech has the capability to support the complete design cycle.  Our vast experience is used to advise and recommend solutions for a diverse range of products and processes.

• Aluminium, Copper and Brass backing   
• Double-sided and multi-layer bonding
• Both conductive and non-conductive bond films 
• Complex machined structures
• Thermal Management Solutions
  • Silicon Aluminium
  • Copper/Invar/Copper
  • Copper/Molybdenum/Copper