Teledyne Labtech has a policy of continuous investment and now boasts a capability that can meet the most demanding RF/Microwave requirements. Teledyne Labtech can offer blind and buried, plated through vias (THP), laser cut cavities, embedded resistors and connectors.
- Mixed Dielectric Multilayer PCB
- Embedded resistors connector pins and capacitors
- Complex machined and laser cut structures
- Metal-cored PCB
- Blind and buried via hole technology