Teledyne Microwave Solutions


Teledyne Microwave Solutions has developed an innovative low cost custom packaging solution utilizing Teledyne Labtech's established microwave printed circuit board techniques and the use of low cost organic materials for single chip & MCM (Multichip Module) applications. Markets served include Defense, Aerospace, and Telecommunications.

TMS MMIC PACKAGING AT-A-GLANCE

Small-Signal-Amplifier

  • Single chip & multi chip module (MCM) solutions
  • LCP packages
  • Competitive pricing for high and low volume quantities
  • Excellent thermal performance >7w dissipation
  • Excellent RF performance at Ka band
  • Low cost tooling and short lead times for new designs
  • Perfect for auto assembly process
  • Available as SMD, BGA, drop in and flange configurations
  • Flexible footprint and cavity changes available

Explore TMS MMIC PACKAGING

KEY FEATURES

TMS has developed a cavity package that demonstrates excellent high frequency, thermal and electrical characteristics by raising the MMIC in a precisely machined, fully copper plated cavity. The resultant optimization of short bond wire lengths ensures minimal loss of chip performance. Applications and Markets include Defense, Aerospace, Telecommunications, LNAs, T/R modules, and PA modules. Our MMIC packaging is also suitable for high power GaN applications up to and including Ka-band.


 
Teledyne Microwave Solutions  |  11361 Sunrise Park Drive, Rancho Cordova, CA 95742

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